Global 3D IC and 2.5D IC Market 2018 by Manufacturers, Regions, Type and Application, Forecast to 2023

  • receipt Report ID : 148011
  • calendar_today Published On: Apr, 2019
  • file_copy Pages: 128
  • list Electronics

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

Scope of the Report:

This report focuses on the 3D IC and 2.5D IC in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period

In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

The worldwide market for 3D IC and 2.5D IC is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Manufacturers, this report covers

TSMC (Taiwan)

Samsung (South Korea)

Toshiba (Japan)

ASE Group (Taiwan)

Amkor (U.S.)

UMC (Taiwan)

Stmicroelectronics (Switzerland)

Broadcom (U.S.)

Intel (U.S.)

Jiangsu Changjiang Electronics (China)

Market Segment by Regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia and Italy)

Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

South America (Brazil, Argentina, Colombia etc.)

Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers

3D wafer-level chip-scale packaging

3D TSV

2.5D

Market Segment by Applications, can be divided into

Consumer electronics

Telecommunication

Industry sector

Automotive

Military and Aerospace

Smart technologies

Medical devices

There are 15 Chapters to deeply display the global 3D IC and 2.5D IC market.

Chapter 1, to describe 3D IC and 2.5D IC Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of 3D IC and 2.5D IC, with sales, revenue, and price of 3D IC and 2.5D IC, in 2016 and 2017;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;

Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D IC and 2.5D IC, for each region, from 2013 to 2018;

Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;

Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;

Chapter 12, 3D IC and 2.5D IC market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;

Chapter 13, 14 and 15, to describe 3D IC and 2.5D IC sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

Frequently Asked Questions

The base year for the study has been considered 2019, historic year 2014 and 2018, the forecast period considered is from 2020 to 2027. The regions analyzed for the market include North America, Europe, South America, Asia Pacific, and Middle East and Africa. These regions are further analyzed at the country-level. The study also includes attractiveness analysis of type, application and regions which are benchmarked based on their market size, growth rate and attractiveness in terms of present and future opportunity for understanding the future growth of the market.

Market is segmented on the basis:

  • By Type
  • By Application
  • By Region
  • By Country
  • By Manufacturer

The report offers in-depth analysis of driving factors, opportunities, restraints, and challenges for gaining the key insight of the market. The report emphasizes on all the key trends that play a vital role in the enlargement of the market from 2019 to 2026.

The report provides company profile of the key players operating in the market and a comparative analysis based on their business overviews industry offering, segment market share, regional presence, business strategies, innovations, mergers & acquisitions, recent developments, joint venture, collaborations, partnerships, SWOT analysis, and key financial information.

Table of Contents

1 Market Overview

1.1 3D IC and 2.5D IC Introduction

1.2 Market Analysis by Type

1.2.1 3D wafer-level chip-scale packaging

1.2.2 3D TSV

1.2.3 2.5D

1.3 Market Analysis by Applications

1.3.1 Consumer electronics

1.3.2 Telecommunication

1.3.3 Industry sector

1.3.4 Automotive

1.3.5 Military and Aerospace

1.3.6 Smart technologies

1.3.7 Medical devices

1.4 Market Analysis by Regions

1.4.1 North America (United States, Canada and Mexico)

1.4.1.1 United States Market States and Outlook (2013-2023)

1.4.1.2 Canada Market States and Outlook (2013-2023)

1.4.1.3 Mexico Market States and Outlook (2013-2023)

1.4.2 Europe (Germany, France, UK, Russia and Italy)

1.4.2.1 Germany Market States and Outlook (2013-2023)

1.4.2.2 France Market States and Outlook (2013-2023)

1.4.2.3 UK Market States and Outlook (2013-2023)

1.4.2.4 Russia Market States and Outlook (2013-2023)

1.4.2.5 Italy Market States and Outlook (2013-2023)

1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)

1.4.3.1 China Market States and Outlook (2013-2023)

1.4.3.2 Japan Market States and Outlook (2013-2023)

1.4.3.3 Korea Market States and Outlook (2013-2023)

1.4.3.4 India Market States and Outlook (2013-2023)

1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)

1.4.4 South America, Middle East and Africa

1.4.4.1 Brazil Market States and Outlook (2013-2023)

1.4.4.2 Egypt Market States and Outlook (2013-2023)

1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)

1.4.4.4 South Africa Market States and Outlook (2013-2023)

1.4.4.5 Nigeria Market States and Outlook (2013-2023)

1.5 Market Dynamics

1.5.1 Market Opportunities

1.5.2 Market Risk

1.5.3 Market Driving Force

2 Manufacturers Profiles

2.1 TSMC (Taiwan)

2.1.1 Business Overview

2.1.2 3D IC and 2.5D IC Type and Applications

2.1.2.1 Product A

2.1.2.2 Product B

2.1.3 TSMC (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.2 Samsung (South Korea)

2.2.1 Business Overview

2.2.2 3D IC and 2.5D IC Type and Applications

2.2.2.1 Product A

2.2.2.2 Product B

2.2.3 Samsung (South Korea) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.3 Toshiba (Japan)

2.3.1 Business Overview

2.3.2 3D IC and 2.5D IC Type and Applications

2.3.2.1 Product A

2.3.2.2 Product B

2.3.3 Toshiba (Japan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.4 ASE Group (Taiwan)

2.4.1 Business Overview

2.4.2 3D IC and 2.5D IC Type and Applications

2.4.2.1 Product A

2.4.2.2 Product B

2.4.3 ASE Group (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.5 Amkor (U.S.)

2.5.1 Business Overview

2.5.2 3D IC and 2.5D IC Type and Applications

2.5.2.1 Product A

2.5.2.2 Product B

2.5.3 Amkor (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.6 UMC (Taiwan)

2.6.1 Business Overview

2.6.2 3D IC and 2.5D IC Type and Applications

2.6.2.1 Product A

2.6.2.2 Product B

2.6.3 UMC (Taiwan) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.7 Stmicroelectronics (Switzerland)

2.7.1 Business Overview

2.7.2 3D IC and 2.5D IC Type and Applications

2.7.2.1 Product A

2.7.2.2 Product B

2.7.3 Stmicroelectronics (Switzerland) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.8 Broadcom (U.S.)

2.8.1 Business Overview

2.8.2 3D IC and 2.5D IC Type and Applications

2.8.2.1 Product A

2.8.2.2 Product B

2.8.3 Broadcom (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.9 Intel (U.S.)

2.9.1 Business Overview

2.9.2 3D IC and 2.5D IC Type and Applications

2.9.2.1 Product A

2.9.2.2 Product B

2.9.3 Intel (U.S.) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

2.10 Jiangsu Changjiang Electronics (China)

2.10.1 Business Overview

2.10.2 3D IC and 2.5D IC Type and Applications

2.10.2.1 Product A

2.10.2.2 Product B

2.10.3 Jiangsu Changjiang Electronics (China) 3D IC and 2.5D IC Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)

3 Global 3D IC and 2.5D IC Sales, Revenue, Market Share and Competition by Manufacturer (2016-2017)

3.1 Global 3D IC and 2.5D IC Sales and Market Share by Manufacturer (2016-2017)

3.2 Global 3D IC and 2.5D IC Revenue and Market Share by Manufacturer (2016-2017)

3.3 Market Concentration Rate

3.3.1 Top 3 3D IC and 2.5D IC Manufacturer Market Share in 2017

3.3.2 Top 6 3D IC and 2.5D IC Manufacturer Market Share in 2017

3.4 Market Competition Trend

4 Global 3D IC and 2.5D IC Market Analysis by Regions

4.1 Global 3D IC and 2.5D IC Sales, Revenue and Market Share by Regions

4.1.1 Global 3D IC and 2.5D IC Sales and Market Share by Regions (2013-2018)

4.1.2 Global 3D IC and 2.5D IC Revenue and Market Share by Regions (2013-2018)

4.2 North America 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

4.3 Europe 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

4.4 Asia-Pacific 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

4.5 South America 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

4.6 Middle East and Africa 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

5 North America 3D IC and 2.5D IC by Countries

5.1 North America 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

5.1.1 North America 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

5.1.2 North America 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

5.2 United States 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

5.3 Canada 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

5.4 Mexico 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6 Europe 3D IC and 2.5D IC by Countries

6.1 Europe 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

6.1.1 Europe 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

6.1.2 Europe 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

6.2 Germany 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6.3 UK 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6.4 France 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6.5 Russia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

6.6 Italy 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7 Asia-Pacific 3D IC and 2.5D IC by Countries

7.1 Asia-Pacific 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

7.1.1 Asia-Pacific 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

7.1.2 Asia-Pacific 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

7.2 China 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7.3 Japan 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7.4 Korea 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7.5 India 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

7.6 Southeast Asia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

8 South America 3D IC and 2.5D IC by Countries

8.1 South America 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

8.1.1 South America 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

8.1.2 South America 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

8.2 Brazil 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

8.3 Argentina 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

8.4 Colombia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9 Middle East and Africa 3D IC and 2.5D IC by Countries

9.1 Middle East and Africa 3D IC and 2.5D IC Sales, Revenue and Market Share by Countries

9.1.1 Middle East and Africa 3D IC and 2.5D IC Sales and Market Share by Countries (2013-2018)

9.1.2 Middle East and Africa 3D IC and 2.5D IC Revenue and Market Share by Countries (2013-2018)

9.2 Saudi Arabia 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9.3 UAE 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9.4 Egypt 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9.5 Nigeria 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

9.6 South Africa 3D IC and 2.5D IC Sales and Growth Rate (2013-2018)

10 Global 3D IC and 2.5D IC Market Segment by Type

10.1 Global 3D IC and 2.5D IC Sales, Revenue and Market Share by Type (2013-2018)

10.1.1 Global 3D IC and 2.5D IC Sales and Market Share by Type (2013-2018)

10.1.2 Global 3D IC and 2.5D IC Revenue and Market Share by Type (2013-2018)

10.2 3D wafer-level chip-scale packaging Sales Growth and Price

10.2.1 Global 3D wafer-level chip-scale packaging Sales Growth (2013-2018)

10.2.2 Global 3D wafer-level chip-scale packaging Price (2013-2018)

10.3 3D TSV Sales Growth and Price

10.3.1 Global 3D TSV Sales Growth (2013-2018)

10.3.2 Global 3D TSV Price (2013-2018)

10.4 2.5D Sales Growth and Price

10.4.1 Global 2.5D Sales Growth (2013-2018)

10.4.2 Global 2.5D Price (2013-2018)

11 Global 3D IC and 2.5D IC Market Segment by Application

11.1 Global 3D IC and 2.5D IC Sales Market Share by Application (2013-2018)

11.2 Consumer electronics Sales Growth (2013-2018)

11.3 Telecommunication Sales Growth (2013-2018)

11.4 Industry sector Sales Growth (2013-2018)

11.5 Automotive Sales Growth (2013-2018)

11.6 Military and Aerospace Sales Growth (2013-2018)

11.7 Smart technologies Sales Growth (2013-2018)

11.8 Medical devices Sales Growth (2013-2018)

12 3D IC and 2.5D IC Market Forecast (2018-2023)

12.1 Global 3D IC and 2.5D IC Sales, Revenue and Growth Rate (2018-2023)

12.2 3D IC and 2.5D IC Market Forecast by Regions (2018-2023)

12.2.1 North America 3D IC and 2.5D IC Market Forecast (2018-2023)

12.2.2 Europe 3D IC and 2.5D IC Market Forecast (2018-2023)

12.2.3 Asia-Pacific 3D IC and 2.5D IC Market Forecast (2018-2023)

12.2.4 South America 3D IC and 2.5D IC Market Forecast (2018-2023)

12.2.5 Middle East and Africa 3D IC and 2.5D IC Market Forecast (2018-2023)

12.3 3D IC and 2.5D IC Market Forecast by Type (2018-2023)

12.3.1 Global 3D IC and 2.5D IC Sales Forecast by Type (2018-2023)

12.3.2 Global 3D IC and 2.5D IC Market Share Forecast by Type (2018-2023)

12.4 3D IC and 2.5D IC Market Forecast by Application (2018-2023)

12.4.1 Global 3D IC and 2.5D IC Sales Forecast by Application (2018-2023)

12.4.2 Global 3D IC and 2.5D IC Market Share Forecast by Application (2018-2023)

13 Sales Channel, Distributors, Traders and Dealers

13.1 Sales Channel

13.1.1 Direct Marketing

13.1.2 Indirect Marketing

13.1.3 Marketing Channel Future Trend

13.2 Distributors, Traders and Dealers

14 Research Findings and Conclusion

15 Appendix

15.1 Methodology

15.2 Data Source

List of Tables and Figures

Figure 3D IC and 2.5D IC Picture

Table Product Specifications of 3D IC and 2.5D IC

Figure Global Sales Market Share of 3D IC and 2.5D IC by Types in 2017

Table

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