Publish Date: Apr, 2019|Report ID: 149337|Price: $3480
The gigabit interface converter (GBIC) is a transceiver that is used for converting the optical signals to electric current and vice versa. The gigabit interface converter is deployed in the Ethernet systems and fiber op...
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Factors driving the growth of the market are; rising adoption of automation in various end-user industries, growing demand for wireless devices, increasing miniaturization of devices, surging need for more efficient inte...
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Scope of the Report:Printed equipment is of crucial importance in Internet of Things (IoT), as it is a major advancement that boosts technological development. Silicon-based sensors are the vital components that are conn...
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The evaluation electronics is a basic part of a light curtain without integrated electronics and can be mounted sevaral meters away from the light curtain.Scope of the Report:The worldwide market for Evaluation Electroni...
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Digital Readouts (DRO) is a numeric display, usually with an integrated keyboard and some means of numeric representation. Its integral computer reads signals generated by linear encoders or (less frequently) rotary enco...
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Interface electronics adapt the encoder signals to the interface of the subsequent electronics. They are used when the subsequent electronics cannot directly process the output signals from encoders, or if additional int...
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The Internet of Things (IoT) is a network of connected physical objects embedded with sensors. IoT allows these devices to communicate, analyze and share data about the physical world around us via networks and cloud-bas...
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Bioelectronics is a field of research in the convergence of biology and electronics.Scope of the Report:The worldwide market for Bio Electronics is expected to grow at a CAGR of roughly xx% over the next five years, will...
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The demand for Wireless Charging Integrated Circuits (ICs) will be increased in the next few years due to high demand for the smart phones, tablets, laptops, digital cameras, surging need for electric vehicle infrastruct...
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Three Dimensional Integrated Circuits (3D ICs) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connec...
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